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| Feature |
2009 |
2010 |
2011 |
| Base Material |
CEM3,
Normal-Tg FR4,
High-Tg FR4,
Halogen free,
BT / Rogers / PTFE |
CEM3,
Normal-Tg FR4,
High-Tg FR4,
Halogen free,
BT / Rogers / PTFE |
CEM3,
Normal-Tg FR4,
High-Tg FR4,
Halogen free,
BT / Rogers / PTFE |
| Max. Layer Count |
16 |
20 |
24 |
| Max. PCB Size (in.) |
22x26 |
22x26 |
22x26 |
| Base copper |
1/3 oz - - 4 oz |
1/3 - - 4 oz |
1/3 - - 4 oz |
| Copper thickness (outer) |
4 oz |
5 oz |
5 oz |
| Max. Board Thickness mm (mil) |
3 (120) |
3 (120) |
3 (120) |
| Min, Core Thickness mm (mil) |
0.05 (2) |
0.05 (2) |
0.05 (2) |
| Min. Line Width / Spacing |
Inner um (mil) |
75/100 (3 4) |
75/75 (3/3) |
75/75 (3/3) |
| Outer um (mil) |
100/100 (4/4) |
75/75 (3/3) |
75/75 (3/3) |
| Min. Mechanical Drill Size (mm) |
0.2 |
0.2 |
0.2 |
| Min. HWTC um (mil) |
175 (7) |
175 (7) |
175 (7) |
| Min. Soldermask Opening um (mil) |
50 (2) |
50 (2) |
50 (2) |
| Finest SMT Pitch mm (mil) |
0.40 (16) |
0.45 (18) |
0.45 (18) |
| BGA Device Pitch (Base Copper 1oz) (mil) |
0.25-0.3 (10-12) |
0.25-0.3 (10-12) |
0.25-0.3 (10-12) |
| Type of Surface Finish |
HASL, lead free HASL, ENIG, Flash gold, Thick gold, Selective gold plating, OSP, Selective OSP /HASL, Immersion Tin, Immersion Silver |
HASL, lead free HASL, ENIG, Flash gold,Thick gold, Selective gold plating, OSP, Selective OSP /HASL, Immersion Tin, Immersion Silver |
HASL, lead free HASL, ENIG, Flash gold,Thick gold, Selective gold plating, OSP, Selective OSP /HASL, Immersion Tin, Immersion Silver |
| Impedance Control |
+/- 10% |
+/- 7% |
+/- 7% |
| Warpage |
0.7% |
0.5% |
0.5% |
| Buried Vias |
Yes |
Yes |
Yes |
| HDI capability |
2+N+2, N+N |
3+N+3, N+N |
3+N+3, N+N |
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