Gold Board General Specification
| 1. | Hole size tolerance | : +/- 0.08 mm | (PTH hole) |
| : +/- 0.05 mm | (NPTH hole) | ||
| : +0.1/-0.05 mm | (Punch hole) | ||
| 2. | Hole location tolerance | : +/- 0.08 mm | (Drill hole) |
| : +/- 0.10 mm | (Punch hole) | ||
| 3. | Minimum hole size | : 0.3 mm | (T ¡Ø 1.6mm) |
| 4. | Line width tolerance | : +/- 10% | (Half oz copper) |
| : +/- 10% | (one oz copper) | ||
| 5. | Line space tolerance | : +/-10% | (Half oz copper) |
| : +/-10% | (one oz copper) | ||
| 6. | Min. Bonding lead width | : 0.10 mm | (Half oz copper) |
| : 0.12 mm | (one oz copper) | ||
| 7. | Min. Bonding lead space | : 0.10 mm | (Half & one oz copper) |
| 8. | Minimum line width | : 0.08 mm | (Half oz copper) |
| : 0.12 mm | (one oz copper) | ||
| 9. | Minimum line space | : 0.08 mm | (Half oz copper) |
| : 0.10 mm | (one oz copper) | ||
| 10. | Mimimum pad size | : diameter 0.30mm >drill size | (Dry film & Half oz copper) |
| : diameter 0.40mm >drill size | (Dry film & one oz copper) | ||
| : diameter 0.40mm >drill size | (silk-screen & Half oz copper) | ||
| : diameter 0.50mm >drill size | (silk-screen & one oz copper) | ||
| 11. | Outline tolerance (L x W) | : +/- 0.10 mm | |
| 12. | Board thickness | : 0.10mm to 3.2 mm | |
| 13. | Registration | : +/- 0.20 mm | (Silk-screen) |
| : +/- 0.08 mm | (Dry film) | ||
| 14. | Plating thickness | : 4um - 35um | (Copper per customer request) |
| : 4um - 9 um | (Nickel) | ||
| : 0.01um-0.05um | (flash gold) | ||
| : 0.05um or above | (thick gold as per customer request) | ||
| 15. | Printing Solder mask | : 0.15mm | (clearance) |
| : 0.15mm | (line coverage) | ||
| : i.e. the space between the line to circuit pad to be 0.30mm | |||
| 16. | Wet film Solder mask | : 0.08mm | (clearance) |
| : 0.08mm | (line coverage) | ||
| : i.e. the space between the line to circuit pad to be 0.16mm | |||
| 17. | V-cut location tolerance | : +/- 0.15 mm | |
| 18. | Space of Circuitry to edge | : 0.30 mm | (punch) |
| : 0.50 mm | (V-cut) | ||
| 19. | V-cut remain thickness | : 1/3 of the board thickness +/-0.10mm | |
| 20. | Under cut (for Etching) | : Etching factor >= 1 | |
| : total 0.02mm | (half oz copper single side PCB) | ||
| : total 0.03mm | (half oz copper double side PCB) | ||
| : total 0.02mm | (one oz copper single side PCB) | ||
| : total 0.04mm | (one oz copper double side PCB) | ||
| 21. | Bevelling angle | : 30°, 45°, 50° | |
Detailed Specification will be provided upon request.