HAL General Specification
| 1. | Hole size tolerance | : +/- 0.08 mm | (PTH hole) |
| : +/- 0.05 mm | (NPTH hole) | ||
| : +0.1/-0.05 mm | (Punch hole) | ||
| 2. | Hole location tolerance | : +/- 0.08 mm | (Drill hole) |
| : +/- 0.10 mm | (Punch hole) | ||
| 3. | Minimum hole size | : 0.3 mm | (T ¡Ø 1.6mm) |
| 4. | Line width tolerance | : +/- 10% | (Half oz copper) |
| : +/- 20% | (one oz copper) | ||
| 5. | Line space tolerance | : +/-10% | (Half oz copper) |
| : +/-20% | (one oz copper) | ||
| 6. | Minimum line width | : 0.15 mm | (one oz copper) |
| 7. | Minimum line space | : 0.15 mm | (one oz copper) |
| 8. | Mimimum pad size | : 0.30mm >drill size | |
| 9. | Outline tolerance (L x W) | : +/- 0.10 mm | |
| 10. | Board thickness | : 0.60mm to 3.2 mm | |
| 11. | Base copper thickness | : <=3 oz copper | (0.004 inches/ 102 micron) |
| 12. | Registration | : +/- 0.08 mm | |
| 13. | Plating thickness | : Copper min. 25 micron | (0.001 inches) |
| : Solder 7~12.5 micron | (280~500 micro-inches) | ||
| 14. | Edge connector thickness | : Nickel > 2.5 micron | (100 micro-inches) |
| : Gold 0.01~0.05 micron | (flash) | ||
| : 0.05 micron or above | (per customer request) | ||
| 15. | Wet film Solder mask | : 0.08mm | (clearance) |
| : 0.08mm | (coverage) | ||
| : i.e. the space between the line to circuit pad to be 0.16mm | |||
| 16. | V-cut location tolerance | : +/- 0.15 mm | |
| 17. | V-cut remain thickness | : 1/3 of the board thickness +/-0.10mm | |
Detailed Specification will be provided upon request.