Multi-Layer (3-8Layers) General Specification for Inner-Layer
| 1. | Board Thickness after Pressing | : min. thickness 0.4mm |
| : max. thickness 3.2mm | ||
| : thickness tolerance ¡Ó0.125mm | ||
| 2. | Warp | :SMT Board¡Ø0.75% |
| Others ¡Ø1.5% | ||
| 3. | Min. line width | : 0.1mm |
| 4. | Min. spacing | : 0.12mm (half oz Cu) |
| : 0.15mm (one oz Cu) | ||
| : 0.2mm (two oz Cu) | ||
| 5. | Line width and spacing tolerance | : ¡Ó20% |
| 6. | Min. annular ring | : 0.15mm |
| 7. | Min. clearance | : 0.35mm |
| 8. | Min. thermal gap | : 0.15mm |
| 9. | Inner registration | : 0.05mm |
Outer layer specification will follow the Double sided nickel / gold and H.A.L specification.
Detailed Specification will be provided upon request.